Supercritical Carbon Dioxide: the next Generation Solvent for Semiconductor Wafer Cleaning Technology
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چکیده
In this paper, we report on the removal of photoresist, post-etch process residues and particles for various patterned semiconductor wafers using supercritical carbon dioxide (SCCO2)/chemical modifier formulations. Optimization of the chemical formulations was determined using data obtained from statistical analysis and designed experiments. Characterization of the processed samples via scanning electron microscopy (SEM), optical microscopy and fourier transform infrared spectroscopy (FTIR) revealed that process conditions and chemical derivatization are important to cleaning patterned wafers. The results of our investigations illustrate the potential of SCCO2 as a viable cleaning technology for nextgeneration integrated circuits.
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تاریخ انتشار 2003